Patent intelligence · US
US 7183334
Low temperature molding compositions with solid thermoplastic elastomer thickeners and fiber reinforcement
Low temperature molding compositions with solid thermoplastic elastomer thickeners and fiber reinforcement
Patent details — US 7183334
- Jurisdiction
- US
- Status
- granted
- Grant date
- Feb 27, 2007
- Expiration
- Feb 22, 2027
- Applicant
- Reinforced Polymers, Inc.
- Claims
- 34
- CPC classes
- A61K, A61K6/887
Quick answer
US 7183334 (Low temperature molding compositions with solid thermoplastic elastomer thickeners and fiber reinforcement) is held by Reinforced Polymers, Inc.. Status: granted. Granted Feb 27, 2007. Expires Feb 22, 2027 (1 year remaining) — relevant for patent-cliff and LOE planning.
Key facts
- Applicant
- Reinforced Polymers, Inc.
- Grant date
- Expiration
- Claims
- 34
- CPC classes
- A61K, A61K6/887
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Frequently asked questions
What is US patent 7183334?
US 7183334 (Low temperature molding compositions with solid thermoplastic elastomer thickeners and fiber reinforcement) is held by Reinforced Polymers, Inc.. Status: granted. Granted Feb 27, 2007. Expires Feb 22, 2027 (1 year remaining) — relevant for patent-cliff and LOE planning.
Who owns US 7183334?
Reinforced Polymers, Inc. is listed as the applicant in USPTO PatentsView records indexed by NovaPharmaNews. We track 11 pharmaceutical patents for this assignee.
When does US 7183334 expire?
Our index shows an expiration date of Feb 22, 2027 (1 year from today). Confirm material dates against USPTO, FDA Orange Book, or qualified counsel before contractual decisions.